Advanced packaging (semiconductors)

Advanced packaging in the semiconductor industry refers to a collection of techniques for assembling multiple integrated circuits (ICs) or other components into a single package, often with the goal of increasing performance, reducing size, and improving power efficiency. Unlike traditional packaging which primarily focuses on protecting the die and providing electrical connections to a circuit board, advanced packaging actively participates in enhancing the IC’s functionality.

Key characteristics of advanced packaging include:

• High Density Interconnects: Advanced packaging technologies enable a significantly higher density of interconnects compared to traditional methods. This allows for more complex and faster communication between the various dies within the package.

• Heterogeneous Integration: Advanced packaging facilitates the integration of different types of dies (e.g., CPUs, GPUs, memory) fabricated using different processes and materials, optimizing overall system performance.

• 3D Integration: Stacking dies vertically (3D integration) allows for increased density and shorter interconnect lengths, resulting in improved performance and reduced power consumption.

• Fan-Out Wafer Level Packaging (FOWLP): This technique extends the die area by embedding it in a reconstituted wafer, allowing for more I/O connections and improved thermal performance.

• Through-Silicon Vias (TSVs): TSVs are vertical interconnects etched through the silicon die, enabling direct communication between stacked dies.

• Chiplets: Advanced packaging enables the use of smaller, specialized dies ("chiplets") that are interconnected within a single package. This modular approach can improve design flexibility, reduce costs, and accelerate time-to-market.

Benefits of advanced packaging include:

• Improved Performance: Shorter interconnects and higher bandwidth lead to improved performance.
• Reduced Size: Integrating multiple components into a single package allows for smaller and more compact designs.
• Lower Power Consumption: Shorter interconnect lengths reduce power consumption.
• Increased Functionality: Heterogeneous integration enables the combination of different functionalities into a single package.
• Improved Reliability: Advanced packaging techniques can enhance the reliability of the overall system.
• Cost Effectiveness: In certain situations, the modularity provided by Chiplets, for example, can improve overall cost effectiveness in comparison to monolithic die designs.

Advanced packaging is crucial for applications requiring high performance, low power consumption, and small form factors, such as mobile devices, high-performance computing, artificial intelligence, and automotive electronics. The continued development and adoption of advanced packaging technologies are essential for pushing the boundaries of semiconductor technology.