TO-263

The TO-263 (Transistor Outline Package 263), also known as D²PAK (for Discrete Package), is a surface mount plastic package commonly used for power semiconductors such as MOSFETs, voltage regulators, diodes, and other similar devices. It is larger and has a higher power dissipation capability compared to the smaller D-PAK (TO-252) package.

The package is characterized by a relatively large flat mounting surface on the back, typically designed to be attached to a heatsink on the printed circuit board (PCB) for thermal management. This surface allows for efficient heat transfer away from the semiconductor die.

The TO-263 package typically has three or more leads/terminals for electrical connection to the PCB. The lead configuration can vary depending on the specific device housed within the package. The standard package body dimensions are defined by industry standards.

Due to its robust design and ability to handle significant power dissipation, the TO-263 is widely used in various applications, including automotive electronics, power supplies, motor control, and industrial equipment. It offers a good balance between size, thermal performance, and cost-effectiveness.